|Dr Lee Teck Kheng - Assistant Treasurer|
Dr Lee Teck Kheng received the B.S. degree in mechanical engineering and the M.S. degree in materials science and engineering from the National University of Singapore in 1995 and 1999, respectively and the Ph.D. degree in Mechanical and Aerospace Engineering from the Nanyang Technology University, Singapore, in 2006. He had been with the semiconductor packaging industry for eighteen years, working from the historical package of DIP to flip-chip packages, WLCsp and system-in-package. He joined the Institute of Microelectronics (IME), Singapore, in 1997, researching in the areas of MEMS, CSP, and flip-chip packaging. In 1999, he joined Micron Semiconductor Asia Pte Ltd as a Senior Technical Member, responsible for substrate supplier management and leading some research programs in the field of advanced packaging and material characterization. He is currently the director of Technology Development Centre (TDC) for ITE College Central, leading a team of engineers and researchers to support the local industry development in Semiconductor, Automation, ICT and electronics sector. Under the leadership, the TDC centre have secured more than 15 grants worth S$4.6M. He has authored and co-authored more than 60 papers in journal and international conferences. Currently, he holds 64 U.S patents, pending another 20 U.S patents from issuing. He has served as a Technical committee member for Singapore Chinese Chamber of Commerce (SCCCI), Semiconductor Equipment and Materials International (SEMI) and Institute of Engineering, Singapore (IES). He is also listed as Who’s Who in the World 2007, 2013-2015 as well as listee of IBC Leading Engineers of the World in 2013-2015. Currently, he acts as co-convenor to represent Singapore in reviewing IEC standard for Semiconductor and IC packaging.