Gary Eves is the Senior Vice President of Global Engineering Operations and Singapore Country Manager of NXP Semiconductors. In that role, he is responsible for all external wafer foundry and OSAT business supporting NXP in the automotive, industrial and commercial business segments. Additionally, he is responsible for Test Innovation at NXP along with enterprise data software tools.

Prior to this position, Gary held Operations Engineering roles within NXP in the Connectivity and Security business. Prior to joining NXP in 2016, Gary held engineering roles at Broadcom, Multilink Technology, Conexant System, Rockwell Semiconductor and Northern Telecom. Gary holds an MBA from Pepperdine University (USA) as well as a Bachelor of Applied Science in Chemical Engineering from the University of Ottawa (Canada).