Surface Mount Technology (SMT) Manufacturing and Process Challenges
The goal of greater functional integration is impacting both SMT assembly and IC packaging with technological and manufacturing challenges. Numerous package styles, multi-chip packages and 3D packaging approaches are changing the face of traditional SMT assembly. The growth of packages involving multiple dies on organic substrates has brought SMT processes into the realm of the packaging industry. SMT know-how is being rapidly adopted by the backend process in the manufacturing of MCMs and SIPs, custom packages and specialty modules. This seminar combines the basic to intermediate level of such packages and its manufacturing guidelines for SMT as well as backend and SMT hybrid assembly.
The following critical materials applications will be covered:
- SMT History and Process Overview
How SMT came about and what are the advent and technological advancements in the SMT components and manufacturing complexities.
- Solder Paste, Screen Printing and Adhesives
Solder Paste Rheology and solder paste particle size and printing technology (stencil design and printers) are shaping the new era of SMT technology towards super
miniaturization and hybrid assembly.
- Pick and Place (P&P)
How pick and place technology is reshaping the cycle time, floor space and machine utilisation together with ROI. Multiple axes as well as IOT combined pick and place is key today
- Soldering and the Reflow Process
The metallurgical and chemistry aspects of solder paste play a critical role is shaping and forming a good solder joint. Different heat transfer and flux classification with respect to solder paste is also key as well as thermal profiling.
- Cleaning Criteria
Often SMT hybrid would require the cleaning process and we will touch-base on the different cleaning technology and chemical suitable for hybrid SMT.
- Rework Methodology
Rework would be allowable for 0603 chip and above and also for only micro-
- Fundamentals to advance levels on SMT/ SMT Hybrid processes
- Understnd the direct and indirect materials used in the process
- Yield improvement of SMT
- SMT Process trouble shooting skills
- Cost saving activities in the SMT line.
WHO SHOULD ATTEND
This course is designed for Packaging Engineer, Process Engineer, FEA Engineer, Materials Engineer, Sub-Con Management Engineer and other to have deep understanding about SMT Manufacturing
1. Component identifications and measurement
- Surface mount devices and through hole components
- Types of active and passive devices and their nomenclatures and identification
- Types of printed circuit board and its application
2. Solder paste printing
- Explanation of solder paste, types of solder paste used in the market, leaded and lead Free, low temp and high temp solder paste
- Solder paste printing process and the operation of printers
- How to design a good stencil, aspect ratio and area ratio
- How a stencil is made, materials, life applications and also stencil history
3. Components mounting
- Basic operations on component mounting
- What are the types of components in the market, how a component is mounted and the machineries concept of mounters
4. Reflow soldering
- Basic operations of a reflow profile and oven
- Profile selection, profiling methodology, real life examples and types of reflow ovens
5. Cleaning technology
- Types of cleaning technologies, aqueous, ultrasonic, centrifugal, chemical basics for cleaning solutions and
- real-life examples
6. Rework methodology
- Basic operations and types of rework machine and suitable nozzles
7. Types of soldering defects and workmanship std IPC 610A
8. Case Studies and Q&A session
Mr. Geoffrey Tan
Degree in Mechanical Engineering &
Master degree in Business Administration
Geoffrey Tan graduated with a Degree in Mechanical Engineering and a Master degree in Business Administration. He has 15 years of working experience in high volume manufacturing in the field of process and equipment engineering from various multinational company. His last position held is SMT Operations manager cum FA manager in a public listed multinational SMT company.
His experience includes leading a team of process and R&D engineers in yield optimization, SMT advance process technologies, SMT problem solving, Design for Manufacturability (DFM) and SMT equipment selection. Off-hand he also provides consultancy in stencil design.
His hands-on knowledge and experience in failure analysis would be an added value in solving SMT processes and materials related problems. Amongst the advance FA tools used would be TOF-SIMS, ESCA/XPS, SEM-EDX, CSAM, X-section, etc from local and overseas institutions and universities.
He trained many in SMT related seminars and equipment selection for the right process. His services also encompass SMT process problem analysis and remedial steps, failure analysis on SMT and semiconductor packages and materials counterfeit detection services for semiconductor and PCBA packages and assembly. He often employs process characterization and simulation techniques in his problem-solving processes. His motto “There is always a better way with a different approach