Understanding the Enigma of Epoxy Molding Compound (EMC) : Its Complexity & Interaction

COURSE OVERVIEW

Production cost and process control are the most important factors in running an efficient and effective semiconductor molding process. The productivity of a production line depends on the efficiency of the molding process which is dependent on factors like the material characteristics and its properties. A good understanding of the materials (MC) properties and ability to synergize the mold design, package structure, dimension and molding techniques would enhance the robustness of molding process in production.

Effective utilization of the molding compound and the molding process is important to increase the productivity that may be site specific in many cases. Understanding the interaction between materials properties with mold process and tooling is important. Experience and knowledge from the industry experts in handling molding compounds at different machines, mold chase design, environment, process, package structure and dimension is crucial in building up the skill in managing molding production lines.

This workshop offers a basic knowledge of MC from the chemistry and formulation point of view. In addition, participants will be exposed to in-depth knowledge on molding process and interaction with EMC, with some real life case studies as examples to specific solutions. These case studies will help engineers to better understand the problems and run their lines in an efficient and effective manner.

Please register your interest for the event by clicking below. Alternatively you can drop an email to delia@ssia.org.sg

COURSE FEES:

SSIA Members: S$1,080 nett per pax
Non-Members: S$1,200 nett per pax

COURSE OBJECTIVES

The course aims to provide participants (engineers, supervisors and Managers who are directly or indirectly dealing with MC) with the understanding and the knowledge competency in managing MC utilization, as described following:

Chemistry and function of the MC ingredients, Impact of raw materials, ingredients toward the final properties of EMC, Basic understanding of Manufacturing, Quality & testing of EMC, Molding technique , Common molding defects and its probable causes with case study

At the end of the workshop, participants will be able to:
1. Understand the basic Epoxy Molding Compound Chemistry and its characteristics
2. Understanding interaction between EMC and molding process and defects
3. Identify probable causes of the molding defects whether due to the material or molding process
4. Find solutions to common molding problems

WHO SHOULD ATTEND

Process engineer, product engineer, NPI, RnD, Development, FA engineer for Semiconductor Assembly Operation.

FAST SKILL BUILDING METHODOLOGY

The experience and knowledge sharing by the trainer will help establish high level of knowledge transfer/skill building to the audience in shortest time.

COURSE OUTLINE

DAY 1

1. Semiconductor Molding Compounds (SCMC) :

    • Basic Chemistry, Formulation and

2. Raw Materials Functions

3.Basic Polymer Science

4.EMC Formulations

5. Raw materials in EMC, their functions and technology

6. Resin, Hardener, Filler, Catalyst, Release Agents, Stress Technology, Adhesion Technology etc.

7. Raw materials in EMC, their functions and technology

8. Resin, Hardener, Filler, Catalyst, Release Agents, Stress Technology, Adhesion Technology etc.

9. Raw materials in EMC, their functions and technology

10. Resin, Hardener, Filler, Catalyst, Release Agents, Stress Technology, Adhesion Technology etc.

11. EMC Manufacturing Process

12. Extrusion and Pelletizing

13. EMC Characterization and purposes and Interaction with Molding Process

DAY 2

1. Molding Process, Mold Design, Molding Defect and Trouble Shooting

2. Introduction to Transfer Molding Machines

3. Mold Designs

4. Transfer Molding Process

5. Molding Process in Transfer Molding

6. Interaction of EMC with molding process and tooling.

7. TSV Reliability

  • Preheating
  • Transfer Time
  • Transfer Speed, Transfer Profile..
  • Transfer Pressure
  • Clamp Pressure & etc

8. Q&A session

9. End of class

INSTRUCTOR PROFILE

Mr GOH, KS

Technical Lead/Global Technical Service Manager

Goh KS has more than 24 years of experience in Epoxy Molding Compound / Power for electronics/ electrical/semiconductor applications. He started his career in 1990 with Nitto Denko Electronic Materials and later with Hewlett Packard (which is now Broadcom) prior to joining Dexter Electronic Materials (which is now under Henkel) in 1994.

KS is an expert in polymeric materials used in semiconductor packaging especially molding compounds. He was a Technical Lead/Global Technical Service Manager with Henkel and he was hands-on person in problem solving and troubleshooting. KS has extensive knowledge in molding compound, from R&D, formulation, process development to its applications.

KS has played a critical role in managing mold compound projects for his past employers. Being a technical guy, he has managed to identify root causes and solved lots of issues related to EMC and molding
issues. He has with him a compilation of case studies and root causes of various EMC problem and issues. KS has also involved himself extensively in upgrading the knowledge and skills of application engineers and sales personnel internally for his employer and customers. He had conducted special trainings for many international semiconductor firms.

KS graduated with a B.Sc (Hons) (1990) and a Master of Science (Polymer Technology) (1996) .

REGISTRATION