Rose Guino has been with Henkel since 2007. She is based in Irvine, California and is currently on assignment in Southeast Asia as the Manager Application Engineering. She has more than 18 years of experience in Advanced Packaging & Semiconductor Packaging Materials. She was a pioneer for the industry’s first Thermal Compression Non-Conductive Paste (TC-NCP) that enabled fine pitch Cu pillar flip chip, as well as the Non-Conductive Film (NCF) that enabled the 3D TSV stack for high bandwidth memory. She has a PhD in Polymer Chemistry from the University of Connecticut and was a post-doctoral Fellow in the Materials Research Lab at the University of California, Santa Barbara.