Wang Li leads Micron’s global Pkg Development and Engineering Team, advancing semiconductor packaging for high-performance NAND and DRAM applications. With over 20 years of experience, Wang Li has driven innovations in industry technical challenges and custom solutions for different platforms. Wang Li holds multiple patents for advanced packaging solutions that improve product quality, cost, and productivity. Wang Li is also a key contributor to next-generation memory packaging solutions, supporting innovations that enhance performance and power efficiency, and a featured speaker at industry events.